JPH0342677Y2 - - Google Patents
Info
- Publication number
- JPH0342677Y2 JPH0342677Y2 JP9282685U JP9282685U JPH0342677Y2 JP H0342677 Y2 JPH0342677 Y2 JP H0342677Y2 JP 9282685 U JP9282685 U JP 9282685U JP 9282685 U JP9282685 U JP 9282685U JP H0342677 Y2 JPH0342677 Y2 JP H0342677Y2
- Authority
- JP
- Japan
- Prior art keywords
- cell
- molecular beam
- pbn
- beam source
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 238000002844 melting Methods 0.000 claims description 10
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 229910052582 BN Inorganic materials 0.000 claims description 6
- 239000000463 material Substances 0.000 description 8
- 239000012212 insulator Substances 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000001451 molecular beam epitaxy Methods 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005566 electron beam evaporation Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000011364 vaporized material Substances 0.000 description 1
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9282685U JPH0342677Y2 (en]) | 1985-06-19 | 1985-06-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9282685U JPH0342677Y2 (en]) | 1985-06-19 | 1985-06-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS622237U JPS622237U (en]) | 1987-01-08 |
JPH0342677Y2 true JPH0342677Y2 (en]) | 1991-09-06 |
Family
ID=30649967
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9282685U Expired JPH0342677Y2 (en]) | 1985-06-19 | 1985-06-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0342677Y2 (en]) |
-
1985
- 1985-06-19 JP JP9282685U patent/JPH0342677Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS622237U (en]) | 1987-01-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH07300666A (ja) | シリコン蒸発用分子線源およびこれに用いるるつぼの製造方法 | |
US6913675B2 (en) | Film forming apparatus, substrate for forming oxide thin film, and production method thereof | |
JPH0342677Y2 (en]) | ||
US5114559A (en) | Thin film deposition system | |
EP0280198B1 (en) | Method of forming diamond film | |
JPH0673543A (ja) | 連続真空蒸着装置 | |
JPH09195036A (ja) | 蒸着装置、及び薄膜製造方法 | |
JPH06280004A (ja) | 電子ビーム蒸発源 | |
JPH0558775A (ja) | 分子線エピタキシヤル装置 | |
JPH11189872A (ja) | 凝縮によって基材の被覆を形成する方法 | |
JP2600336B2 (ja) | 高熱伝導性ic用基材の作製方法 | |
JPS60211823A (ja) | 薄膜半導体形成装置 | |
JPH0387360A (ja) | 真空蒸着装置 | |
JPH04116155A (ja) | 薄膜の形成方法 | |
JPS6043914B2 (ja) | スパツタリング製膜方法 | |
JPS6136374B2 (en]) | ||
JPH01165763A (ja) | 電子ビーム蒸発源用ルツボ | |
JP3418795B2 (ja) | 溶融蒸発用金属組成物および金属の溶融蒸発方法 | |
JPS63213664A (ja) | イオンプレ−テイング装置 | |
JPS6326347A (ja) | 金属硼化物薄膜の製造法 | |
JPH0247252A (ja) | 複合材料膜の製造方法 | |
JPH0196373A (ja) | イオン・プレーテイング装置 | |
JPS62256794A (ja) | ダイヤモンド薄膜の作製方法 | |
Anner | Physical Vapor Deposition; Sputtering | |
JPH05166727A (ja) | 化合物薄膜の製造方法 |